Thermal interface materials provide a path for heat transfer between a heat-generating device and a cooling plate enhancing thermal conductivity. Heat is an unavoidable byproduct of electronic device operation. However, it can degrade performance and damage components if it is not controlled. Thermal interface materials are used in device designs to absorb and redirect heat away from critical device components preventing overheating.

PLITEK® manufactures thermal interface components such as insulator pads, gap pads, and thermal transfer tapes.

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