Finetech

Finetech offers sub-micron accuracy die bonders for medical device bonding and micro assembly – sensors, chip-on-flex, bio-MEMS, implantables, microfluidics, lab-on-chip, ultra thin and small die, etc. Process flexibility found within one platform – high force, ACP/ACF, thermo-compression /-sonic, eutectic, and epoxy bonding. Advanced rework equipment for medical components including small passives and high density packages.