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Manufactures adhesives and encapsulants for electronics and optoelectronics assembly. Products include electrically and thermally conductive adhesives. The company additionally offers ultra-low-stress adhesives and anisotropically conductive adhesives. UV-curable glob-top encapsulants also are supplied. Underfill encapsulants for flip chips, CSPs, and BGAs, including reworkable underfill encapsulants, are available.
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