SelectConnect Technologies

SelectConnect Technologies manufactures three-dimensional molded interconnect devices (3D-MID). A 3D-MID consists of circuit traces embedded onto molded thermoplastics to form electrical pathways and landings for surface mount components to reduce the number of components, wires and interconnects, size, weight and complexity. Put functionality in a smaller space.

Compared to 2-D printed circuit boards or a flexible circuits, a 3D-MID can take the shape of a molded component allowing circuit paths to be created on non-conductors, used for the enclosure, chassis, and device structure.