Corwil Technology Corp.

Corwil Technology Corporation is the premier, US-based, IC assembly and test services subcontractor. The company offers full back-end assembly services starting from wafer sort, thinning & dicing through die-attach, flip chip and/or wirebond, package sealing and final test. Corwil has the experience to meet customers' demanding challenges in flip chip assembly, aluminum and gold wire bonding, custom encapsulation and plastic molding, wafer probe/final test, and wafer thinning, polishing and dicing. Corwil is dedicated to meeting customer expectations, producing excellent quality products, and providing superior service to its growing base of more than 1000 customers.