C-MAC Microcircuits ULC

With over 30 years’ experience delivering high-reliability electronic modules and systems on a global basis, our engineering teams have developed a wide range of capabilities including:

- Thick-film hybrid and LTCC (low-temperature co-fired ceramic) substrates
- Hermetically sealed chip-and-wire assemblies
- Gold and aluminium wire bonding
- PCB assembly
- Full system assembly

Our expertise in rugged hybrid microelectronics is particularly relevant to applications such as surgical power tools, where reliable operation after 1000 autoclave sterilization cycles in steam at 135°C is required.

Our proposition to medical electronics OEMs is enhanced by our ISO 1348...